聚酰亚胺平面/调制薄膜的制备与测量

Fabrication and Measurement of Polyimide Plane/perturbation Film

采用联苯四羧酸二酐(PMDA)和对苯二胺(PDA)为二酐和二胺,以N,N-二甲基乙酰胺(DMAc)为溶剂制备了聚酰胺酸溶液(PAA).采用旋涂工艺,以K9玻璃或调制模版为衬底,制备了聚酰亚胺(PI)平面/调制薄膜.对其厚度、结构、表面粗糙度和表面调制图形进行了测量,研究了其厚度与旋涂速度和PAA溶液浓度的对应关系.结果表明,PAA溶液在马弗炉中进行370℃热处理,可以完全转化为PI;通过旋涂法制备PI平面薄膜的平均粗糙度Ra的最大值和最小值分别为3.7 nm和3.1 nm;PI平面薄膜最小厚度为1μm,且其厚度随着旋涂速度增大而减小,随着PAA溶液浓度的增大而增大;PI调制薄膜的周期和振幅分别为100μm和4.8μm,在调制图形转移过程中,周期不变,而振幅存在0.2μm的转移误差.

By using PMDA, PDA and DMAc as raw materials, PI Plane/perturbation films were fabricated via spin - coating process. The thickness, composition, surface smoothness and perturbation patterns of PI films were measured. The influence of thickness on the speed and concentration was investigated. Based on the analysis of FFIR spectra, the PAA solution can be completely converted to PI after a 370 ℃ heat treat. The Ra＇s maximum and minimum of PI plane film are 3.7 nm and 3.1 nm. The thickness of PI film is decreased by the increasing of speed and increased by the increasing of concentration while its minimum thickness is 1 μm. The period and amplitude of PI perturbation films are 100 μm and 4.8 μm. During the transition process of perturbation patterns, the period keeps constant whereas the deviation of amplitude is 0.2 μm.