微量铜对8030电工圆铝杆组织性能的影响

Effect of trace copper on microstructure and properties of 8030 electrical round aluminum rod

利用金相显微镜、扫描电镜、导电仪等分析测试了添加不同含量的Cu元素对8030铝合金的显微组织及电学性能等的影响。结果表明,Cu元素的加入能使铝合金的铸态组织明显细化,经过热挤压后合金组织为细小的等轴晶,其上弥散分布着富Cu和Si的第二相。随着Cu元素的增加,合金抗拉强度提高,电导率下降。

The influence of different content of Cu element on the microstructure and electrical properties of 8030 aluminum alloy were analyzed by metallurgical microscope, scanning electron microscope and electric conductivity meter. The results show that the as - cast microstructure of Al alloy is obviously refined by the addition of Cu element. After hot extrusion, the microstructure of the alloy is fine equal axial crystal, dispersing the second phase of the Cu and Si. With the increase of Cu element content, the tensile strength of the alloy increases and the conductivity decreases.