银烧结技术在功率模块封装中的应用

Silver Sintering Technology for Power Module Packaging Application

银烧结技术是一种新型的高可靠性连接技术,在功率模块封装中的应用正受到越来越多的关注。作为传统软钎焊技术的替代方案,银烧结技术在宽禁带半导体封装中具有良好的应用前景。阐述了银烧结技术原理,介绍了目前银烧结技术在功率模块中的应用情况,总结了影响银烧结层质量的因素,并从检测手段、材料成本及专利方面对银烧结技术的应用前景进行了展望。

Silver sintering technology has received more and more attention for power module packaging application due to its high reliability. It has become a potential replacement candidate to solder technology in wide bandgap semiconductor packaging. The mechanism, influencing factors as well as the application in power module packaging of silver sintering technology has been reviewed. Analyze three challenges that must be overcome for mass application of silver sintering technology： the detection method, the cost of materials, and the patent landscape. Expected to be helpful to research institutions and semiconductor companies that are interested in silver sintering technology and its application.