摘要
通过对比观察使用锡铅共晶焊料制成的导线焊接样件和过渡件样件在经历深冷环境温度冲击前后焊点外观、拉伸强度、金相和微观组织以及合金层厚度,发现使用锡铅共晶焊料制成的两种样件在经历深冷环境后,其焊点外观未有明显变化,焊点内部没有出现断裂,微观组织没有明显变化。虽然焊点在经历深冷环境温度冲击后拉伸强度略有下降,但合金层厚度满足行业内要求。
The appearance, tensile strength, metallographic？microstructures and thickness of the alloy layer of solder joints of samples of the wire and the transition piece, which were made of tin-lead eutectic solder, were observed and compared before and after the temperature shock in the cryogenic environment. It was found that the appearance of two kinds of solder joints made of the tin-lead eutectic solder did not change obviously, the fracture did not occur inside the solder joint, and the microstructure did not change obviously. The tensile strength decreased slightly, but the thickness of the alloy layer was suffi cient to the industry requirements.
作者
徐幸
陈该青
程明生
XU Xing CHEN Gai-qing CHENG Ming-sheng(No. 38 Research Institute of China Electronics Technology Group Corporation, Hefei 230088, Chin)
出处
《电子工艺技术》
2016年第6期323-326,共4页
Electronics Process Technology
基金
国防基础科研项目(项目编号:A1120132016)
关键词
锡铅共晶焊料
深冷环境
温度冲击
tin-lead eutectic solder
cryogenic environment
temperature shock
