航天用CQFP封装器件力学加固工艺技术研究

Mechanical Reinforcement Technology Research of CQFP in Aerospace Industry

采用不同的固封方式,验证了航天用CQFP封装器件在严苛力学条件下的抗振效果,并通过热循环试验表明了不同胶黏剂由于热膨胀系数的差异对焊点产生的影响。力学试验表明,使用灌封S113胶+四角点封环氧6101和底填、四角点封均使用环氧55/9+引脚刷涂S113胶固封方式,两者均能满足力学加固的要求,力学试验后器件和焊点均无损伤。但是温度循环试验表明,前者因热失配更大,对CQFP器件的焊点造成了较大的损伤,而后者对焊点未造成明显损伤。因此,针对CQFP器件的加固,应根据产品不同的使用工况进行区别对待。

The anti-vibration effect of the CQFP for aerospace under severe mechanical conditions was verified with different adhesive reinforcement methods, and the influence of different thermal expansion coeffi cient between the different adhesives was demonstrated by thermal cycling test. Both of the method of potting S113 and encapsulated epoxy 6101 at the four points and the method of filling the end and the four corners are sealed with epoxy 55/9 and the pins brushed with S113 can meet the requirements of mechanical reinforcement because of the device and the solder joint are not damaged after the mechanical tests. But the temperature cycling test shows that the former was more damaged because of the more thermal mismatching, and the latter did not cause obvious damage to the solder joints. Therefore, the method of CQFP device reinforcement should be different based on the different application.