摘要
为确保微波组件壳体内部电路长期工作的可靠性,激光封焊工艺正广泛应用于微波组件壳体气密性封装工艺中。采用正交实验的方法研究了激光功率、焊接速度、激光频率和偏焦量对铝合金壳体气密性的影响。结果表明:在实验的参数范围内,焊接速度影响最大,激光功率影响最小,使用最优的工艺参数进行激光封焊实验,壳体的漏气率最小,达到6.5×10-10 Pa·m3/s,气密性最优。
In order to ensure the reliability of the circuit in the microwave module, the laser seal welding technology is widely used in gas-tightness packaging of microwave module. The infl uence of laser power, welding speed, laser frequency and focal offset on gas tightness of aluminum alloy module by the method of orthogonal experiment was studied. The result shows that the welding speed is the most important, while the laser power is the least important in the range of experimental parameters. The best air leak rate of aluminum alloy module can be achieved by using the optimal technology parameters, which is about 6.5×10-10 Pa·m3/s.
作者
王成
孙乎浩
陈澄
WANG Cheng SUN Hu-hao CHEN Cheng(N0.723 Institute of China shipbuilding industry corporation, Yangzhou 225001, China)
出处
《电子工艺技术》
2016年第6期342-344,共3页
Electronics Process Technology
关键词
微波组件
激光封焊
正交实验
气密性
microwave module
laser seal welding
orthogonal experiment
gas tightness