摘要
电子产品中PBGA器件本体侧铜焊端有OSP处理及镀镍镀薄金两种不同处理方式,针对两种不同处理方式所带来的焊点组织以及可靠性的差异进行对比研究,对比分析了本体侧铜焊端不同处理方式焊点组织及其形成机理,以及环试后焊点微裂纹产生的原因,对装联工艺给出了建议。
The terminal finish of PBGA device has two different ways, OSP and plating nickel then plating thin gold, in electronic products at present. Compare structure and reliability of the solder joint with OSP and plating nickel then plating thin gold. Analyze microstructure of solder joint and its formation mechanism with different fi nishes, and the reason of micro cracks in joint after the thermal cycling test. Suggestions on the assembly process are given at last.
作者
闫海新
YAN Hai-xin(The Open University of China press Co. Ltd., Beijing 100039, China)
出处
《电子工艺技术》
2016年第6期345-347,共3页
Electronics Process Technology
关键词
PBGA
焊端处理
组织
可靠性
PBGA
terminal fi nish
microstructure
reliability
