摘要
PcBN复合片脱层等问题是合成过程中的常见问题,文章采用C扫描设备对复合片脱层的过程进行了研究。虽然影响复合片质量的因素很多,但复合片脱层会导致复合片性能下降,文章主要比较了不同合成压力对PcBN复合片质量——特别是内部结合质量的影响。对复合片脱层的原因进行了分析,认为实质上是不同材质结合后存在残余应力,释放的应力过大会导致脱层现象,匹配好工艺压力利于复合片质量稳定,对复合片生产有一定指导意义。
Delamination is one of the common problems in the process of synthesis for PcBN compact.The process of delamination of PcBN compact has been studied through C scan equipment.While many factors can affect the quality of the compact,delamination may lead to a decline in the performance of the compact.The influence of different syn-thetic pressure on the quality of PcBN compact,especially the internal bond quality,has been studied in this article.Based on the analysis of the cause of the delamination,it is believed that the real cause of it is the residual stress generated after the bond of different type of materials,the release of the stress leads to the delamination.Application of ap-propriate process pressure will help to stablize the quality and has a certain instructive sig-nificance to the production of the PcBN compact.
出处
《超硬材料工程》
CAS
2016年第6期24-29,共6页
Superhard Material Engineering
基金
桂工信投资[2016]258号
关键词
PCBN
脱层
压力
质量
PcBN
delamination
pressure
quality
