焊接层空洞率对LED背光源组件热阻的影响

Effects of Voiding Percentages in Devices Solder Layer on LED Back Light Unit Thermal Resistance

焊接层空洞是引起电子器件和光电子器件失效的一种重要因素,同时也是应用系统可靠性研究的重要内容之一。它增大了焊接层的热阻使得功率半导体芯片由于散热不良而失效,本文通过实验研究了空洞率对LED背光源组件热阻的影响,结果显示随着焊接层空洞率的增大,样品结温与组件热阻都明显增加,且基本呈线性增长趋势,当空洞率约为17%时,热阻增长6.03%,结温提高1.74%;当空洞率约为73%时,热阻增长24.7%,结温提高9%。

Void in solder layer is the main factor in the failure of electrical device and optoelectronic devices and the main question of the reliability of the application system. The increasing thermal resistance in solder layer is the main reason for the heat diffusion failure of power semiconductor chip. This paper focused on the effects of voiding percentages on LED back light unit thermal resistance. The results showed that with the increasing of voiding percentages, the junction temperature and the thermal resistance are increased significantly and almost appeared linear growth. When the voiding is about 17% , the thermal resistance and the junction temperature increase 6.03% and 1.74%. When the voiding is about 73% , the thermal resistance and the junction temperature increase 24.7% and 9%.