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改善聚合物热导率的研究进展

Research Progress of Thermal Conductivity Enhance of Polymers
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摘要 分别从导热填料粒子性质、聚合物基体、两相界面结构性质,以及材料加工工艺等角度出发,深入探讨了影响聚合物热导率的因素和机制,总结了提高和改善聚合物导热性能的方法。提高导热粒子和基体的热导率,在聚合物基体内形成稳定的最大化导热粒子通路等措施均可有效改善聚合物热导率。 The methods to improve the thermal conductivity of polymer were summarized from the properties of thermally conductive particles, polymer matrix, phase interface structure, and processing technology, respectively. The influence factors and corresponding mechanism concerning the thermal conductivity of polymers were discussed. The thermal conductivity of polymeric composites can be enhanced through the following methods, such as increasing the thermal conductivity of filler and matrix, forming stable and maximum numbers of thermally conductive paths inside the matrix.
作者 徐丽 周文英 龚莹 周瑶 赵伟 闫智伟 Xu Li Zhou Wenying Gong Ying Zhou Yao Zhao Wei Yan Zhiwei(College of Chemistry & Chemical Engineering, Xi'an University of Science and Technology, Xi' an, Shaanxi, 710054 Xianyang Tianhua Electronic Technology Co. , Ltd, Xianyang, Shaanxi, 712000)
出处 《现代塑料加工应用》 CAS 北大核心 2016年第6期52-55,共4页 Modern Plastics Processing and Applications
基金 国家自然科学基金(51577154) 教育部重点科技项目(212175) 陕西省自然科学基础计划(2016JM5014) 陕西省教育厅自然科学基金(14JK1485)
关键词 聚合物复合材料 相界面 微结构 热性能 表面处理 polymer-matrix composites (PMCs) interphase microstructure thermal properties surface treatments
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  • 1He Fu(贺福).Carbon Fiber and Its Application Technology(碳纤维及其应用技术).Beijing : Chemical Industry Press, 2004:240
  • 2Xanthos M,Narh K.Polym Composite,1998,19:768-780.
  • 3Soutis C.Mat Sci Eng A-Struct,2005,412:171-176.
  • 4Liu G,Xun S,Vukmirovic N,Song X,Olalde-velasco P,Zheng H Battaglia V,Wang L,Yang W.Adv Mater,2011,40:4679-4683.
  • 5Kim M,Rhee K,Lee J,Huia D,Laud K.Compos Part B-Eng,2011,42:1257-1261.
  • 6Yang L,Cheng S,Ding Y,Zhu X,Wang Z,Liu M.Nano letters,2011,12:321-325.
  • 7Khalifa A,Nanni A.Cement Concrete Comp,2000,22:165-174.
  • 8Sen R,Liby L,Mullins G.Compos Part B-Eng,2001,32:309-322.
  • 9Cao M,Song W,Hou Z,Bo W,Jie Y.Carbon,2010,48:788-796.
  • 10Lee G,Park M,Kim J,Lee J I,Yoon H G.Compos Part A-Appl S,2006,37:727-734.

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