湿化学清洗设备在GaN基LED正装芯片制程中的应用

Application of Wet Chemical Cleaning Equipment in GaN-Based LED Mounting Process

讨论了湿化学清洗设备的产能和耗水(DIW)计算方法,以100 mm晶圆,单批次流片量50片为例,阐述了湿化学清洗设备整机和单元模块的各类配置;依据晶圆在各刻蚀清洗工艺后的表面形状,明确了各清洗设备在工艺中的作用。湿化学清洗设备可依据生产情况灵活处理生产需求,已成为LED芯片制程生产线中应用最多的设备之一。

In this paper, the production capacity and DI water consumption calculation method of the wet chemical cleaning equipment are discussed. The configuration of the wet chemical cleaning equipment and the unit modules are described with the example of 4inch wafer and single batch of 50 chips. According to the wafers in the etching process after the surface topography, the role of the cleaning process equipment has been clear. Wet chemical cleaning equipment can be flexible to solve production requirements based on production. Wet chemical cleaning equipment has become one of the key equipment of LED chip technology in the chip process production line.