一种基于仲裁器的键合前硅通孔测试方法

A Method of Prebond TSV Test Based on Arbiter

硅通孔(TSV)故障严重降低了三维集成电路的良率和可靠性。为了在制造流程中尽早精确地排除TSV故障,提出了一种基于仲裁器的键合前TSV测试方法。由于高电平信号通过故障TSV的延迟时间小于无故障TSV,比较被测TSV与无故障TSV的延迟时间,即可判断被测TSV是否存在故障,比较结果由仲裁器给出。依次将被测TSV的延迟时间与不同的延迟时间相比,可对其延迟进行区间定位,实现TSV故障分级。实验结果表明,该方案能够检测出开路电阻大于281Ω的电阻开路故障、泄漏电阻小于223 MΩ的泄漏故障,有效解决了两种TSV故障共存的检测问题。与现有同类方法相比,该方法提高了测试精度,增加了可检测故障范围,并且可以进行故障分级。

Faults in TSV decrease the yield and reliability of 3D-ICs. To screen out these faults early and precisely in the manufacturing flow, a prebond TSV test method using arbiter was proposed. The high level signal delay of faulty TSV was shorter than the fault-free TSV＇ s. So the delay of TSV under test was compared with fault- free TSV＇ s. The faulty TSV was detected and the test results were given by the arbiter. Furthermore, by comparing the delay of TSV under test with different equivalent delays, the delay of TSV was mapped into preset intervals and the TSV fault was graded. The results showed that the method could detect not only the resistive open faults with an equivalent open resistance more than 281 Ω and but also the leakage faults with an equivalent leakage resistance less than 223 MΩ. Both the faults could be detected. The proposed method expanded the scope of fault detection, which had achieved higher precision and fault gradation compared with the previous works.