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浅谈T-CON板金手指问题

Brief Discussion of Bonding Finger on T-Con Board
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摘要 印制线路T-CON板(Timing Controller)进入绑定机进行绑定之前,首先需检查T-CON板上金手指是否合格,超长超薄超窄的T-CON印制线路板上金手指管控一直以来都是技术难题所在。常常以高成本投入;低效率产出;不合格难以管控等状态运营。本文阐述了超长超薄超窄的T-CON印制线路板上金手指检验问题:液晶T-CON板上金手指的判定基准,主要以解决问题、降低成本、统一判定基准、保证质量为根本原则。将检验标准从理论变为实际,彻底改变了以往纸质标准,创造出更合理、更有效、更节省、更优异的金手指判定标准。 The bonding finger on T-CON (Timing Controller) board shall be checked before the T-CON board is bonding with the bonding machine. The bonding finger control on the super thin and narrow T-CON board has always been a puzzle. The cost is high, the yield is low, and the unqualified products are hard to be controlled. This paper discusses how to inspect the bonding finger on super thin and narrow T-CON board in order to reduce the cost and ensure the quality. The practical inspection criteria which are more reasonable, effective, economical and excellent have changed the past theoretical standard.
作者 湛明璧 Zhan Mingbi
出处 《通信与广播电视》 2016年第4期55-60,共6页 Communication & Audio and Video
关键词 表面贴装 液晶 T^CON板 金手指 SMT Liquid crystal T-CON board Bonding finger
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