湿化学法制备Cu-20%W药型罩材料的研究

Preparation of Cu-20%W Liner Material by Wet Chemical Method

采用湿化学法制备Cu-20%W(质量分数)纳米复合粉,经烧结制备了Cu-W药型罩材料。并用XRD、SEM对制备的复合粉体和合金进行了表征。结果表明,本方法制备的复合粉体中W的平均晶粒尺寸为44nm。Cu-20%W合金存在较多孔洞,W在铜基体中出现聚集,钨在铜基体上分布的均匀性需进一步提高。

Cu-W liner materials were sintered by Cu-20% W （mass fraction） nanocorposite powders prepared by wet chemical method. The composite powders and sintered alloys were characterized by XRD, SEM. It was showed that the average grain size of W in the composite powder prepared by this method was 44nm. There were many holes in the Cu-20% W alloy, W aggregates appeared in the copper matrix, the uniformity of the distribution of tungsten in the copper matrix should be further improved.