多层印制电路板凹蚀技术研究

Study of etchback technology for multilayer printed circuit board

多层印制板孔金属化过程中要除去孔壁粘附的熔融树脂和钻屑。如果除钻污量足够大,形成一定深度的蚀刻,而使得内层铜箔完整裸露出来,则称之为凹蚀。本文旨在研究和对比常见几种除钻污方法凹蚀性能的基础上,找出实现凹蚀工艺的最佳方法,以满足其多层印制板各层之间的高可靠性连接。

PTH of MPCB process is for removing those molten resins and cuttings adhering to the hole wall in drilling operation. If the smear is removed enough to form certain depth of etching, the inner coppers will completely exposed from the resin, which is called etchback technology. This work aims to find a best way for realizing etchback technology to satisfy the highly reliable electric connections between layers of MPCB.