摘要
锡球拾放技术是BGA植球的关键技术,真空植球技术适用于BGA芯片或基板植球。真空植球法易发生丢球和锡球被压变形两种植球缺陷。因此有必要对真空植球法关键技术进行分析和改进,以改善植球质量。丢球主要发生在锡球吸取过程,分析吸球过程,为真空植球头的功率设计给出了参考。锡球被压变形发生在植球过程,根据植球时锡球的受力情况,给出了锡球极限压力的计算方法。在此基础上,针对植球缺陷提出一种新的植球压力实时压力控制方案,提升植球良率。在自主研制的BGA植球机上实验并得到了预期效果。
Ball mount method is a key technology in BGA package equipment and Vacuum sucking method is applicable to BGA chips. There are two kinds of Ball Mount defect in vacuum mounting method, theoretical research is necessary to improve mount quality and accuracy. Ball missing happens in sucking process. By analysis ball pick up process, reference is created on power design of vacuum mounter. Ball deformation occurs in planting phases. Ac- cording to the stress analysis of solder ball, a computing method is introduced to calculate the maximum pressure that solder ball can bear. Finally, in order to control ball mount pressure and reduce mount defect, existing pressure con- trol mechanism is improved and experiment on MBA- 2000 shows expected results.
作者
刘劲松
闫雷
王鹤
LIU Jinsong YAN Lei WANG He(School of Mechanical Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China Shanghai Micson Industrial Automation Co, Ltd. , Shanghai 201114, China)
出处
《电子科技》
2017年第1期5-8,共4页
Electronic Science and Technology
基金
上海市科委基础研究重点科技攻关项目(12111101500)
关键词
BGA封装
真空植球法
植球缺陷
植球压力
BGA package
vacuum sucking method
ball mount defect
ball mount pressure
