密封微电子器件真空烘烤工艺研究

Studies of Vacuum Bakeout Process for Hermetic Microelectronic Devices

重点讨论气密封装微电子器件真空烘烤工艺,首先介绍了影响气密封装微电子器件内部气氛的主要因素,这些因素形成的原因以及对气密封装微电子器件的危害。影响气密封装微电子器件可靠性及稳定性的内部因素主要是水汽。分析消除气密封装微电子器件内部水汽及污染物的原理及方法,并详细分析如何通过选择温度、真空度、氮气、烘烤时间以及循环次数等工艺参数,在封装之前对气密封装微电子器件(在-55~125℃范围内释气)进行真空烘烤循环工艺处理,来消除器件内部的水汽及表面吸附的污染物。

The paper introduces the vacuum bakeout process for microelectronic devices. At first the major factors affecting environment inside hermetic devices and root causes are analyzed. One of the major factors is moisture. The paper then explores how to eliminate the moisture and discusses the key parameters during the process. Before the packaging vacuum bakeout cycles are implemented.