摘要
该文根据三维片上网络结构温度特性,提出了一种基于3D Mesh结构的新型热量均衡路由算法TLHB(Transport Layer Heat Balance Routing),并且给出无死锁证明。通过网络仿真软件OPNET14.5,将该算法在一个4*4*4的3D Mesh网络中进行仿真,并与XYZ路由算法,TADR路由算法以及TLAR路由算法进行比较,结果显示TLHB算法在网络性能几乎没有下降的前提下,热量性能指标方面较现有的三维路由算法有所提升。
According to the temperature characteristics of three-dimensional networks on chip,a new heat b- alance routing algorithm TLHB(Transport Layer Heat Balance Routing) is presented,which is based on the s- tructure of 3D Mesh,and gives proof of deadlock free.The algorithm is simulated on 4 *4*4 3D Mesh network to evaluate the performance through OPNET14.5,which is a network simulation software.By comparing the a- lgorithm with XYZ routing algorithm,TADR routing algorithm and TLAR muting algorithm,it shows that without the degradation of network performance,TLHB algorithm had a improvement considering every kind of index of heat performance;compared with the existing three-dimensional routing algorithm.
作者
陈洁坤
管祥生
续鹏
Chen Jie-kun Guan Xiang-sheng Xu Peng(Schcol of Physics and Telecommunication Engineering,South China Normal University,Guangdong Guangzhou 510006)
出处
《电子质量》
2017年第1期1-5,24,共6页
Electronics Quality