聚酰胺树脂固化EP/PAI共混物的反应机理及性能研究

Study on Reaction Mechanism and Performance of Eoxy Resin / Polyamideimide Cured by Polyamides

使用651型聚酰胺树脂(PA)固化环氧树脂(EP)/聚酰胺酰亚胺(PAI)共混物。结合红外谱图(IR)分析反应机制,采用差热(DSC)与热重(TGA)研究其热稳定性,通过冲击性能测试其韧性。结果表明,经PA固化的EP/PAI共混物由于其伯胺与仲胺的活性氢而发生一系列开环反应,并通过酯化反应而形成网状结构;PAI骨架中的仲胺基使共混物的主发热峰随着PAI含量的升高而下降;系统的热稳定性和冲击强度也随着PAI含量的增多而增大,当PAI含量为10 phr时,耐热性能最佳,冲击强度为10.2 k J/m^2。扫描电镜(SEM)分析结果表明,纯EP表现为脆性断裂,而加入PAI出现两相结构,使体系韧性提高。

Polyamide （PA） was used to cure Combined with infrared spectrum （IR） analysis to epoxy resin （EP） and polyamideimide （PAl） blends. investigate the reaction mechanism, differnetial scanning calorimetry （DSC） and thermal gravimetric analysis （TGA） were used to study the thermal stability of the EP/PAI cured blend, and impact test was applied to test the blend＇s toughness. The results show that a series of ring opening reactions occurred in the PA cured EP/PAI blends due to active hydrogen in primary amines and secondary amines, and the network structure was formed by esterification reaction. The secondary amine in the PAL/ framework makes the main heating peak of the cured blend decrease with the increase of PAI content. The thermal stability and impact strength of the cured blend increase with the increase of PAl content also. When the PAI content is 10 phr, the heat resistance is the best, and the impact strength is 10. 2 kJ/ m^2. The cross-section morphology was analyzed by scanning electron microscope （SEM）. The results show that pure EP is brittle fracture. After adding PAI, the blend appears to have a two phase structure, which improves the toughness of the system.