摘要
采用Ti/Ag-Cu/Cu中间层实现了Si_3N_4陶瓷与TiAl合金的钎焊连接,获得了良好的接头.利用SEM,EDS等微观手段,分析了接头界面结构和元素分布情况.结果表明,Si_3N_4陶瓷/Ti/Ag-Cu/Cu/TiAl典型界面微观结构可能为:Si_3N_4/TiN/Ti-Si/Cu-Ti+Ag(s,s)+Cu(s,s)/AlCuTi/TiAl.在连接温度1 133 K、保温时间30 min、接头压力0.040 MPa时,接头四点弯曲强度达到最大值170 MPa.
The Si_3N_4 ceramics was brazed to TiAl alloys with Ti/Ag-Cu/Cu as the interlays,and a good joint was obtained.The interfacial microstructure of the joint and the elements were analyzed by scanning electron microscope(SEM)and energy dispersive spectrometer distribution(EDS).The results show that the typical interfacial microstructure of Si_3N_4/Ti/Ag-Cu/Cu/TiAl may be Si_3N_4/TiN/Ti-Si/Cu-Ti+Ag(s,s)+Cu(s,s)/AlCuTi/TiAl.The influences of brazing temperature,holding time and the pressure of the joint on the four-point bending strength of the joint were researched by using controlling variables method.The four-point bending strength of the joint reaches the maximum of 170 MPa when the brazing temperature,holding time and the pressure of the joint are 1 133 K,30 min and 0.040 MPa,respectively.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2016年第12期91-94,共4页
Transactions of The China Welding Institution
基金
国家自然科学基金资助项目(51405205)
江苏省自然科学基金资助项目(BK2012275)
