铜离子和杂质离子浓度对电解铜箔组织性能的影响研究

Effect of Copper Ion and Impurity Ion Concentration on Microstructure and Properties of Electrolytic Copper Foil

铜箔由于其延展性、轻薄的性能,使铜箔在电子工业中的铜箔基板制造与锂离子电池的制造中被广泛的应用。电解铜箔的生产主要由溶铜生箔、表面处理、分切包装三个部分组成,在制备的过程中,电解液中难免混入一些杂质离子,本文将采用霍尔槽实验进行性能测试,研究铜离子与杂质离子的浓度对电解铜箔组织性能的影响,以供相关从业人员借鉴学习。

Copper foil is extensively used in the manufacture of copper foil substrate and lithium ion battery in the electronics industry due to its ductility and thin performance. Electrolytic copper foil production mainly by dissolving copper foil, surface treatment, cutting and packaging of three parts, in the preparation process, the electrolyte is inevitable mixed with some impurity ions, this will be used Hall slot test for performance testing, research Copper ion and impurity ion concentration on the organization and performance of electrolytic copper foil for the relevant practitioners learn from.