摘要
Interracial dislocation may have a spreading core corresponding to a weak shear resistance of interfaces. In this paper, a conic model is proposed to mimic the spreading core of interfacial dislocation in anisotropic bimaterials. By the Stroh formalism and Green＇s function, the analytical expressions of the elastic fields are deduced for such a dislocation. Taking Cu/Nb bimaterial as an example, it is demonstrated that the accuracy and efficiency of the method are well validated by the interface conditions, a spreading core can greatly reduce the stress intensity near the interfacial dislocation compared with the compact core, and the elastic fields near the spreading core region are significantly different from the condensed core, while they are less sensitive to a field point that is 1.5 times the core width away from the center of the spreading core.
Interracial dislocation may have a spreading core corresponding to a weak shear resistance of interfaces. In this paper, a conic model is proposed to mimic the spreading core of interfacial dislocation in anisotropic bimaterials. By the Stroh formalism and Green＇s function, the analytical expressions of the elastic fields are deduced for such a dislocation. Taking Cu/Nb bimaterial as an example, it is demonstrated that the accuracy and efficiency of the method are well validated by the interface conditions, a spreading core can greatly reduce the stress intensity near the interfacial dislocation compared with the compact core, and the elastic fields near the spreading core region are significantly different from the condensed core, while they are less sensitive to a field point that is 1.5 times the core width away from the center of the spreading core.
作者
Jie LIU
Yuheng ZHANG
Haijian CHU
Jie LIU Yuheng ZHANG Haijian CHU(Shanghai Institute of Applied Mathematics and Mechanics, and Shanghai Key Laboratory of Mechanics in Energy Engineering, Shanghai University, Shanghai 200072, China Department of Mechanics, College of Sciences, Shanghai University, Shanghai 200444, China)
基金
Project supported by the National Natural Science Foundation of China(No.11672173)
the Shanghai Eastern-Scholar Plan
the Innovation Program of Shanghai Municipal Education Commission
