Ni-B/Ni-P焊盘结构对CBGA植球焊点性能的影响

Effects of Ni-B/Ni-P Pad Structures on the Performance of CBGA Solder Joints

化学镀镍工艺因其无需掩膜、区域选择性好和非电镀等特点,被广泛应用于电子封装工业中的沉积工艺。研究了陶瓷球栅阵列(CBGA)封装中Ni-B/Ni-P焊盘镀层结构对焊点性能的影响。结果表明,高温老化过程中,焊点界面金属间化合物(IMC)厚度的增加与老化时间的平方根呈正比关系,Ni-P焊盘与Sn Pb之间形成的金属间化合物呈片状或块状,而Ni-B焊盘与Sn Pb焊料之间形成的金属间化合物呈鹅卵石状,Ni-B焊盘上焊点界面IMC更厚、生长速率更快。随着老化时间的增加,两种焊点剪切力均呈现先增大后减小的趋势,Ni-B焊盘上焊点剪切强度更高。

Due to the process characteristics of without mask,good region-selectivity and non-plating and so on,the chemical nickel plating technology is widely applied in the deposition process in the electronic packaging industry. The influence of the Ni-B/Ni-P solder coating structure on the properties of solder joints in ceramic ball grid array（CBGA） packages was studied. The results show that the increase in the thichness of the intermetallic compound（IMC） at the interface of solder joints is directly proportional to the square root of the aging time. The IMC formed between the Ni-P pad and the Sn Pb presentes the flack or block shape,while the IMC formed between the Ni-B pad and the Sn Pb solder presents the pebble shape. The IMC in the solder joints interface of Ni-B pads is thicker and the growth rate is faster. In addition,the shear force of both solder joints increases first and then decreases with the increase of the aging time,and the solder joint shearstrength of Ni-B pads is higher.