LOW Z-CTEFR-4覆铜板的研制

Development of LOW Z-CTE FR-4 CCL

研究了采用提高高分子材料交联密度和填充无机填料降低复合材料热膨胀系数的方法,开发出一种既经济又具有低Z轴膨胀的FR-4覆铜板。在玻璃化转化温度前Z轴热膨胀系数(Z-CTE)较常规FR-4产品下降35.7%,更接近于铜的热膨胀系数,降低了产品在PCB加工过程中热冲击带来的孔铜断裂风险,产品可靠性明显提高。

The research improves the crosslinking density of high-molecular polymer and fill inorganic insulating filler to decrease CTE of composite, develope low Z-CTE FR-4 CCL. The Z-CTE shrink 35.7% before Tg compare with normal FR-4, closer to the CTE of copper, which reduces the risk of hole copper fracture during PCB heat shock process, obviously improves the product reliability.