摘要
通过直接敷铜(DBC)工艺,在AlN陶瓷基板表面于1 000~1 060℃的敷接温度下制备Cu/AlN材料,利用机械剥离机、场发射扫描电子显微镜和X射线衍射仪分析了Cu/AlN的界面结合强度、界面微观形貌和物相组成。结果表明:铜箔和AlN陶瓷基板间的结合强度超过了8.00N·mm^(-1),铜箔和AlN陶瓷之间存在厚度约为2μm的过渡层,过渡层中主要含有Al_2O_3、CuAlO_2和Cu_2O化合物;随着敷接温度升高,Cu/AlN的界面结合强度逐渐增大。
By direct bonded copper（DBC）process,Cu/AlN material was fabricated successfully on AlN ceramic substrate at bonding temperatures of 1 000-1 060 ℃.The bonding strength,morphology and phase composition of Cu/AlN interface were investigated by mechanic testing equipment,field emission scanning electron microscope and X-ray diffractometer.The results show that the bonding strength of Cu/AlN interface was more than 8.0N·mm^-1,a transition layer with thickness of 2μm was found between copper foil and AlN ceramic,the transition layer was mainly composed of Al2O3,CuAlO2 and Cu2O.The bonding strength of Cu/AlN interface increased as the bonding temperature gradually went up.
作者
谢建军
王宇
汪暾
王亚黎
丁毛毛
李德善
翟甜蕾
林德宝
章蕾
吴志豪
施鹰
XIE Jian-jun WANG Yu WANG Tun WANG Ya-li DING Mao-mao LI De-shan ZHAI Tian-lei LIN De-bao ZHANG Lei WU Zhi-hao SHI Ying(School of Materials Science and Engineering, Shanghai University, Shanghai 200444, China Shanghai Ferrotec Corporation, Shanghai 200444, China)
出处
《机械工程材料》
CAS
CSCD
北大核心
2017年第1期61-64,共4页
Materials For Mechanical Engineering
基金
上海市宝山区科委产学研项目(bkw2014124)
上海市科研计划能力建设项目(14520500300)
关键词
表面金属化
直接敷铜工艺
ALN陶瓷
界面结合强度
surface metallization
direct bonded copper（DBC） process
alumina nitride ceramics
interface bonding strength
