Ti/Al叠层结构低频振动制孔试验研究

Experimental Research on Low Frequency Vibration-Assisted Hole Making of Ti/Al Stacked Structure

钛合金与铝合金叠层构件的装配孔制备过程中存在孔壁质量差、尺寸超差等问题,为解决该问题,开展了低频轴向振动扩孔、铰孔与传统扩孔、铰孔的对比试验,重点分析了其在切屑形态、加工质量等方面的差异。结果表明,振动制孔技术能够产生C形或发条形切屑,利于切屑排出,减小铝合金孔壁的划伤。使用振动辅助技术进行一次扩孔与一次铰孔后,钛合金与铝合金孔壁粗糙度均可低于R_a0.6μm,孔径精度可满足H7公差等级,出口毛刺高度小于200μm。

There are still some problems in assembly holes making of the titanium and alunainum stacks （Ti/Al stacks）, such as the poor holes surface quality and out-of-tolerance diaineter. In this article, low frequency vibration-assisted boring and reaming of Ti/AI stacks were investigatedin compared with the traditional ones.Both chip morphology and processing quality were analyzed. It was found that distinctive mechanical damage of the Aluminum holes surface could be significantly reduced due to the improved extraction of the small chip segments.After one operation of boring and reaming with low frequency vibration assisted processing, The average surface roughness of both titanium and aluminum can reach Ra 0.6μm. The hole diameter can meet a tolerance of H7 and the burr height on exit side can be reduced below 200μm.