全板电镀成本分析与改善研究

Plating process cost analysis and improvement study

在印制电路板诸多工序中,电镀生产过程中消耗的成本占着相对的较大比例,对于降低电镀成本对企业盈利起着至关重要的作用。本文主要分析电镀工序所涉及的主要物料铜球和光亮剂消耗,提出节约成本的措施,从而达到降低电镀成本的目的。

In PCB manufacturing process, the plating process takes a large proportion ot me cost ot me production process consumes. So it＇s very valuable for PCB manufacturing company to reduce plating costs. In this paper, the major consumption of the electroplating process are analyzed which is copper ball and brightener material ,then some cost-saving measures are proposed to achieve the purpose of reducing plating costs.