无钯沉铜新思路

New concept of electroless copper plating without palladium catalyst

无钯沉铜的最大特点是采用Cu^(3+)离子作活化剂,这可缩短生产周期和生产成本,是一种很有发展前途的新工艺。

Electroless Copper Plating without Palladium Catalyst is upgrade version of It has an obvious characteristic to adopt tri-valence cuprous ion as activator. This technology can period and production cost. It is a kind of new technique which has been developed. conventional PTH. shorten production