HDI板激光盲孔灯芯原因分析与改善

Analysis and improvement of HDI laser blind hole wick

印制电路板孔间距越来越小,使得对孔的可靠性要求也相应提高,所以印制电路板产生的导电阳极灯芯就成为影响产品可靠性的重要因素,文章通过对我司HDI产品在使用无卤素材料时出现的盲孔灯芯进行解析,提出改善方向及思路。

The PCB hole spacing becomes smaller, the reliability requirements of the hole also increases, so the anode conductive wick generated by the printed circuit board has become an important factor affecting the reliability of products. Through the analysis of our HDI products in the use of halogen free materials when the blind hole wick appeared, this paper puts forward the improvement direction and ideas.