热处理工艺对Cu-Ni-Si-Fe-P合金组织与性能的影响

Effects of Heat Treatment Process on Microstructure and Properties of Cu-Ni-Si-Fe-P Alloy

向Cu-Ni-Si合金中添加少量的Fe、P,制备了Cu-Ni-Si-Fe-P合金。研究了热处理对Cu-1.7Ni-0.5Si-0.27Fe-0.03P合金显微组织演变、电导率和硬度的影响。结果表明,随着固溶温度升高,合金中树枝状的析出物逐渐溶解,在850℃×1h固溶处理后析出相充分固溶于基体中。合金硬度(HV)随着固溶温度升高而快速下降,最低达到107.39;电导率小幅下降,最低为12.75MS/m。经850℃×1h固溶处理+500℃×3h时效后,硬度(HV)达到208.10,电导率达到23.78MS/m,软化温度达到568.7℃。合金在时效初期先析出大颗粒的NiSiFeP等化合物,时效后分解成较小的FeP和NiSi化合物。

Cu-Ni-Si-Fe-P alloy was prepared by adding a small amount of Fe and P elements into the CuNi-Si alloy.Effects of heat treatment on the electrical conductivity,hardness and microstructure evolution of the Cu-1.7Ni-0.5Si-0.27Fe-0.03 Palloy were investigated by hardness tester,EDS,XRD and SEM.The results show that with the increase of solution temperature,the dendritic precipitates in the alloy are dissolved gradually,and the precipitates are dissolved fully in the matrix after 850 ℃×1hsolution treatment.Hardness of the alloy is declined rapidly with the increase of solution temperature to107.39 HV,and conductivity of the alloy is decreased slightly to 12.75 MS/m.After aging treatment,the conductivity and hardness of the alloy are improved greatly.After 850 ℃×1hsolution treatment and 500 ℃×3haging treatment,the hardness,electric conductivity and soften temperature of the alloy reach 208.10 HV,23.78 MS/m,568.7 ℃,respectively.At initial stage of aging treatment,the NiSiFeP particle compounds are precipitated,and the compounds are decomposed to form FeP and NiSi compounds with the smaller size at the later stage of aging treatment.