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BGA焊接失效的可制造性因素分析

Analysis on the manufacturing factors of BGA welding failure
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摘要 本文以企业实际生产中出现的一个非典型性BGA焊接失效案例为素材,详细介绍了不良原因分析的过程与方法,在可制造性设计方面提出具体建议,为产品设计和工艺技术人员提供经验借鉴。 the failure case for the material in the welding enterprises in the actual production of an atypical BGA, introduces the process and method of failure analysis, in the aspects of design and manufacture of specific recommendations, provide experience for product design and technical personnel.
作者 郑晓亮
机构地区 厦门技师学院
出处 《电子测试》 2017年第1期89-90,共2页 Electronic Test
关键词 BGA焊接失效 非典型性原因 可制造性设计 BGA welding failure atypical cause manufacturability design
分类号 TN405 [电子电信—微电子学与固体电子学]
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电子测试
2017年 第1期

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