超高纯CuMn合金材料微观组织和织构演变研究

Microstructure and Texture Evolution of Ultra-High Pure CuMn Alloy Material

当前超大规模集成电路(ULSI)的特征尺寸已经步入纳米范围,随着特征尺寸的减小,铜互连面临着严重的可靠性问题,采用合金化手段可有效抑制晶界附近的电迁移。因而本文主要研究超高纯铜锰合金材料,通过金相(OM)、电子背散射衍射(EBSD)等分析手段研究超高纯铜锰合金材料塑性形变过程和热处理过程中铜锰合金试样的微观组织变化和轧制、再结晶织构变化。实验结果表明:经过对塑性变形试样的分析后发现,试样微观组织主要由许多破碎的小晶粒及亚晶组成,同时试样中存在典型的轧制织构并且存在大量的小角度晶界。经过退火热处理后,试样的微观组织比较均匀,晶粒细小,晶粒尺寸大约为10.7μm;典型轧制织构组分下降比较明显,典型再结晶织构组分上升,但大部分晶粒处于随机取向,试样退火热处理后几乎全部为大角度晶界。

Current ultra large scale integration circuit（ULSI） are featured with dimensions in the nanoscale region.As the critical dimension shrinks,Cu BEOL（back end of line） systems face reliability impacts.Alloying has been proved to be a promising technique to retard grain boundary electro-migration（EM）.In this paper,Cu Mn for dual-damascene interconnect applications was investigated,the evolution of microstructure and texture after deformation and annealing treatment of Cu Mn alloy was investigated by means of optical microscope（OM） and electron backscattered diffraction（EBSD） system,which was fitted out in the scanning electron microscope（SEM）.The results showed that the microstructure of the deformed sample was mainly composed of broken small grains and crystal,there were typical rolling textures existing and a large number of low-angle grain boundaries in the sample.After annealing treatment,the microstructure was homogeneous,the average grain size was about 10.7 μm,the typical rolling textures decreased obviously and the recrystallization textures were raising,but most of the grains were in a random orientation and the annealing samples were almost consisted of high-angle boundaries.