LTCC基板集成微流通道散热技术

Integrated Microfl uidic Cooling Technology in LTCC

LTCC不仅在微波、毫米波应用领域具有广泛的应用,在基于LTCC的系统级封装(SIP)应用中可实现高密度集成的微系统,成为陶瓷单片集成系统的可行实现方案。然而,LTCC的热导率较差,导致了LTCC基板集成功率器件工作产生的热量不能快速及时散出,成为限制LTCC在高功率微波组件以及多功能微系统中应用的薄弱点。通过将微流散热通道集成于LTCC基板内部,特别是在LTCC基板组装的高功率器件下方,可有效改善LTCC基板的散热特性。结合高密度导热通孔技术以及微流道制造技术,实现了局部孔比例高达50%的高密度导热孔制造。测试结果证实,该LTCC微流体系具备不低于50 W/cm2的散热能力。相关技术可提升LTCC基板在微波功率组件以及LTCC-SIP技术领域的应用范围,为装备的进一步小型化提供技术支撑。

LTCC has wide applications in microwave circuits, especially in the system in package（SIP） based microsystems with high density. However, the low thermal conductivity of LTCC blocks the heat dissipating, which is a unsubstantial point in the high-power microwave module. Through fabricating integrated microfluidic cooling structure in the LTCC, especial under the high-power device, the heat dissipation performance can be improved effectively. Based on the high-density heat-conducting hole technology and the LTCC microfluidic structure fabrication technology, the heat dissipation array structure with a 50% ratio of metallization holes is realized. The testing experiments reveal that, such LTCC structure has a heat dissipation capacity above 50 W/cm2, which can expend the applications of LTCC-based microwave power module, and can provide the technology support for miniaturized equipments.