摘要
随着高电压负载电子产品在航天领域的广泛应用,电子装联生产中非气密电连接器的灌封气密性问题亟待解决。对灌封工艺参数和配置规范展开研究,通过气密试验进行了灌封气密技术验证,分析了非气密电连接器漏气的主要原因,并进一步通过冲击、高低温循环和振动等环境试验的考核对灌封气密技术进行了性能鉴定研究。
High voltage load electronic products has been widely used in military and aerospace field. The problem of potting non air-tightness connectors in the production of electronic assembly needs to be solved. The process parameters and the operating specifications of sealing procedure were studied. The air-tightness of sealing technology was checked by experiments. The reason of air leakage in connectors was researched and performance evaluation was studied with a series of environmental tests.
出处
《电子工艺技术》
2017年第1期21-23,62,共4页
Electronics Process Technology
关键词
电子装联
非气密电连接器
灌封
electronic assembly
non air-tightness connectors
sealing
