摘要
主要针对通孔器件焊点在焊料上出现"环圈"的异常现象进行描述。关于出现该现象的焊点是否为合格焊点,目前还没有标准规定。通过分析该现象焊点产生的原因,并通过对焊点进行金相分析加以验证,从而对该现象的焊点是否为合格焊点进行讨论。
Describe the abnormal phenomenon of soldering points with ring loop on solder on DIP devices. For this type of soldering joint, there are no standards or specifications which can identify whether the spots are qualified or not. Therefore the root reasons of this phenomenon have been analyzed and the quality of soldering joint has been verified and discussed with metallographic analysis.
出处
《电子工艺技术》
2017年第1期33-36,共4页
Electronics Process Technology
关键词
焊点
金相分析
金属间化合物层(IMC)
蠕变变形
soldering joint
metallurgical analysis
intermetallic compound（IMC）
creep deformation
