摘要
PCB电镀过程中产生铜丝已成为影响电镀制程的一个主要缺陷。通过试验对铜丝产生的形态进行分析,对产生电镀铜丝的影响因素进行了系统的试验设计,分析各因素对铜丝形成的影响。从流程维护和系统预防等多方面详细阐述了解决电镀铜丝这一缺陷的解决方案。
Plating copper wire has become a major defect of electroplating process. Analyze the form of the copper wire through experiments. Analyze the influence factors of plating copper wire by DOE test. Research the influence of each factor on this defect. Expound the electroplating solution of resolving copper wire problem from process maintenance and systemic improvement.
出处
《电子工艺技术》
2017年第1期37-40,共4页
Electronics Process Technology
关键词
电镀
铜丝
流程维护
electroplating
copper wire
process maintenance
