QFN热沉焊盘空洞形成机理与解决措施

Forming Mechanism and Solutions of Void on QFN Thermal Pad

QFN热沉焊盘空洞控制是QFN焊接工艺难题之一,也是业界的难题之一。结合业界的一些研究成果,对QFN热沉焊盘空洞的形成机理进行定性分析,并提出了系统性的有效控制措施。

Void control on QFN thermal pad is one of QFN soldering process problems. It is also one of the problems in industry. Qualitatively analyze the formation mechanism of void on QFN thermal pad combining with some research results of the industry, and put forward the systemic and effective control measures.