摘要
以双马来酰亚胺树脂(BMI)为树脂基体,二烯丙基双酚A(DABA)为增韧剂,γ-缩水甘油醚氧丙基三甲氧基硅烷(KH-560)表面改性的SiC颗粒-SiC晶须(SiCP-SiCW)为复配导热填料,浇注成型制备SiC_P-SiC_W/BMI导热复合材料,分析研究SiC形状、用量、质量比及表面改性对SiC_P-SiC_W/BMI导热复合材料的导热性能、介电性能、力学性能和热性能的影响。结果表明,当改性SiC_P-SiC_W用量为40wt%且SiC_P∶SiC_W质量比为1∶3时,SiC_P-SiC_W/BMI导热复合材料具有最佳的综合性能,导热系数λ为1.125W(m·K)^(-1),介电常数ε为4.12,5%热失重温度为427℃。
Functionalized SiC particle-SiC whisker（SiCP-SiCW）hybrid fillers byγ-glycidoxypropyltrimethoxysilane（KH-560）were performed to fabricate the functionalized SiCP-SiCW/bismaleimide（SiCP-SiCW/BMI）thermal conductivity composites,BMI as the polymeric matrix and diallylbisphenol A（DABA）as a toughening agent,respectively.Effects of the shape,content,compound and surface functionalization of SiC fillers on the thermal conductivities,dielectric mechanical properties and thermal stabilities of the functionalized SiCP-SiCW/BMI thermal conductivity composites were investigated.The results show that the functionalized SiCP-SiCW/BMI thermal conductivity composite with 40wt% functionalized SiCP-SiCW（1∶3,mass ratio）hybrid fillers exhibits the best comprehensive performance,the corresponding thermally conductive coefficientλof 1.125 W（m·K）-1,dielectric constantεof 4.12,and 5wt%thermal mass loss temperature of 427 ℃.
出处
《复合材料学报》
EI
CAS
CSCD
北大核心
2017年第2期263-269,共7页
Acta Materiae Compositae Sinica
基金
国家自然科学基金(51403175)
