射频连接器组件温度—高度试验系统设计及评定

Development and Evaluation of Temperature-Altitude Testing System for RF Connector Assembly

随着技术的发展,无论是军用电子装备还是航空航天电子装备都对与之配备的电子元器件提出温度—高度试验要求,由此使得对温度—高度试验系统的研究显得尤为迫切。阐述了采用温度—高度试验夹具配合分子泵、高低温试验箱构建射频连接器组件温度—高度试验系统的原理和方法,确定了该试验方法中不确定度的来源,并以温度—高度试验过程中的典型试验温度为例,对其测量不确定度进行了科学合理的分析。希望这对保障射频连接器组件温度—高度试验结果的准确性和可靠性具有一定指导意义。

With the development of technology, both military and avionics electronic equipments require their electron components to be temperature-altitude tested. So it makes the research of the temperature-altitude test system become urgent. The principle and method of building the temperature-altitude testing system for radio frequency （RF） connector assembly by using temperature-altitude test grip, molecular pump and temperature test chamber are described. The sources of uncertainty in this test method are determined. Taking the typical test temperatures as the example, the reasonable analyses are made on the system testing uncertainty. It is hoped that it could have guiding significance in ensuring the accuracy and reliability of the temperature-altitude test results for RF connector assembly.