摘要
针对陶瓷柱栅阵列(CCGA)封装的焊接界面在热冲击试验中出现的断裂失效问题,探讨了如何通过加固CCGA焊接界面来提高器件可靠性的工艺技术。该工艺通过在焊接区域涂覆适量的环氧胶来对焊接界面进行加固保护,对于提高焊柱的抗热冲击能力具有明显的作用,并且能够有效地提高焊柱的可靠性。此外,为了进一步地提高CCGA器件的组装可靠性,对新型结构焊柱进行了相关的试验验证。
In view of the fracture failure problem of the welding interface of CCGA during the thermal shock test, the process technology of how to improve the reliability of CCGA device by strengthening its welding interface is discussed. In the process, the welding interface is consolidated and protected by depositing moderate epoxy glue in the welding area, which has a significant effect on improving the thermal shock resistance of the welding column, and can effectively improve the reliability life of the welding column. Besides, in order to further the assembly reliability of CCGA devices, the related tests are conducted for the column with new structure. improve welding
出处
《电子产品可靠性与环境试验》
2017年第1期12-17,共6页
Electronic Product Reliability and Environmental Testing
