摘要
低温共烧陶瓷(LTCC)是一种在低温条件(低于1 000℃)下将低电阻率的金属导体(如银、铜等)和陶瓷基体材料共同烧结而成的多层结构。LTCC技术最大的特点之一就是其实现了利用不同层来制作3D结构的可能性。随着技术的发展,对电子元器件和组件的性能和功能的要求越来越高,而对于产品的尺寸却要求其越来越小,LTCC技术恰好能满足这两方面的要求,因而其在微电子领域得到了广泛的应用。对LTCC的工艺流程、技术特点、应用领域和市场前景进行了介绍,以期对相关技术人员更加全面地了解LTCC技术有所帮助。
LTCC is a kind of muhilayer structure formed by dealing with low resistivity metal conductors （such as Ag, Cu, etc.） and ceramic matrix structure with cofiring process in low temperature （less than 1 000 ℃） . One of the biggest characteristics of LTCC technology is that it realizes the possibility of using different layers to make 3D structure. With the development of technology, it requires that the performance and functionality of electronic components and assembiles are getting higher and higher, but also requires that their sizes are getting smaller and smaller, and LTCC is perfectly able to meet these two requirements, so it has been widely used in microelectronics field. Therefore, the process flow, technical features, market prospects of LTCC are introduced, in hope that which can help the understand the LTCC technology. application fields and relevant staffs to fully
出处
《电子产品可靠性与环境试验》
2017年第1期50-55,共6页
Electronic Product Reliability and Environmental Testing
关键词
低温共烧陶瓷
艺流程
技术特点
应用领域
Low Temperature Co-fired Ceramic （LTCC）
process flow
technical feature
ap-plication field
