摘要
基于笼型倍半硅氧烷(POSS)的有机-无机杂化纳米复合低介电材料由于具有良好的综合性能,在微电子封装中存在潜在应用。然而目前基于POSS的可聚合单元通常含有髙极性基团,对材料低介电性能造成了不利影响。基于苯并环丁烯(BCB)基团在高性能低介电材料中的独特优势,利用POSS的Heck反应,在POSS上引入BCB官能团,进而制备形成衍生聚合物。核磁氢谱表明成功实现了POSS的BCB官能化,取代率达到约50%。差示热量测试表明BCBPOSS通过[^(2+)4]环加成实现了交联聚合。热重测试表明BCB-POSS交联树脂具有优异的热稳定性能。扫描探针显微镜结果表明BCB-POSS交联树脂薄膜表面光洁性较好,满足微电子应用的基本要求。
Orangic-inorganic molecular hybrid nanocomposites with Polyhedral oligomeric silsesquioxane(POSS)are of great interest because they offer the potential to microelectronic package.However,there may be polymerized units based POSS usually contain high polar groups,it had a negative impact to low dielectric properties of the material.Based on benzocyclobutene group had unique advantages in low dielectric materials with high performance,Heck reaction was used to modify octavinyl-polyhedral oligomeric silsesquioxane(OV-POSS)with benzocyclobutene,and then a polymer derived was prepared.~1 H-NMR and IR showed that the successful implementation of BCB-POSS,the substituted rate of about 50%.DSC indicated that BCB-POSS can achieve a crosslinked polymer by [2+4]cycloaddition.TGA tests showed BCB-POSS crosslinked resins had excellent thermal stability.AFM results showed that the surface of BCB-POSS crosslinked resin film was bright and clean,which can be applied in microelectronics.
出处
《化工新型材料》
CAS
CSCD
北大核心
2017年第2期52-54,共3页
New Chemical Materials
基金
西南科技大学博士基金资助项目(10zx7116)