镀铜导电聚酰亚胺纤维的制备及其性能研究

Preparation and property of conductive copper-plated polyimide fiber

采用化学镀方法在聚酰亚胺纤维表面进行镀铜,实现聚酰亚胺纤维表面金属化。通过场发射扫描电子显微镜、能谱仪、微电子测试仪等测试手段对所制备的样品进行表征。讨论了工艺条件对镀铜纤维镀层厚度和表面电阻的影响,确定了最佳的施镀时间和温度,并对镀层的形貌、成分、结合强度和导电性能进行了分析。实验结果表明,在时间为10min,温度为33℃条件下化学镀铜处理后,聚酰亚胺纤维表面的镀层覆盖均匀、致密,晶粒细致,厚度约为0.75μm,与纤维结合力好,导电性能优越。

The metallization of polyimide fiber by means of electroless deposition of copper on surface of fiber was operated.The surface morphology and composition of fibers were characterized by FE-SEM and EDS.Influence of process conditions on weight gain percentage and surface resistance was investigated and the optimized process of electroless deposition of copper on the surface of fiber was obtained.In addition,adhesion strength of coating and surface resistance were also measured.The results showed that copper plating on the fiber surface was uniform and compact under the optimized process condition（plating time：10min;temperature：33℃）,furthermore copper grain was fine.The thickness of copper plating was about 0.75μm,and combined well with polyimide fiber.Meanwhile the conductivity of deposits increased.