大功率LED封装颗粒模具成型分离工艺设计

Tooling Process Design for High Power LED Units Forming and Simulation

简述大功率LED器件的机械组成,剖析其引脚弯曲成型特点,制定LED颗粒的引脚折弯工艺,并结合全自动冲压技术,设计了颗粒和框架分离的模具机构,为LED颗粒封装后的制程设计了高效率的模具方案,从而为类似产品全自动模具设计提供了有益借鉴。

The high power light emitting diodes unit mechanical composition and lead forming profile was briefed. The unit conducting leads forming process was formulated for volume production. The mechanism for unit singulation from the skeleton frame was designed for automatic pressing operation. The design concept can be referenced for similar product tooling design.