摘要
精细图形制作的前处理工艺对印制电路板的铜表面粗糙度影响很大。对一款新开发的PTFE覆铜板表面采取机械磨刷、喷砂研磨、化学微蚀3种前处理工艺,通过SEM及粗糙度结果分析了处理后铜面的粗化效果。结果表明,化学微蚀前处理方式有利于获得较好的铜面外观,采用相应的图形制作工艺参数可达到较好的线宽精度要求。
Pretreatment has a great impact on copper surface of printed circuit board during fine pattern manufacture process. Three types of pretreatment technologies, brush scrubbing, pumice and chemical micro-etching, are used for a novel high frequency PTFE laminate. The surface of the copper after three different pretreatments are analyzed by Scanning Electron Microscope（SEM） and Alpha-step IQ surface profiler. The results show that copper surface pretreated by chemical micro-etching is conducive to obtain better copper surface. The line width of PTFE PCB using chemical micro-etching method meets the requirement of 0.1/0.1 mm±0.020 mm.
出处
《电子与封装》
2017年第2期33-36,共4页
Electronics & Packaging
关键词
高频覆铜板
前处理
图形制作
粗糙度
high frequency laminate
pretreatment
pattern manufacture
roughness
