电流值改变对铜包钢导线短路熔痕金相组织的影响

Influence of Current Change on Metallographic Structure of Short Circuited Melted Mark of Copper Clad Steel Wire

电流值改变使铜包钢导线短路熔痕金相组织发生改变。模拟火场中导线短路熔痕的产生条件,设定不同的电流值制备铜包钢导线一次短路熔痕和二次短路熔痕。结果表明:随着电流的增加,一次短路熔痕金相组织中气孔体积增大,板条状马氏体数量减少,无碳化物贝氏体数量增加;随着电流的增加,二次短路熔痕金相组织中气孔体积增大,无碳化物贝氏体数量在减少,珠光体数量增加。

Because of the current changing, the metallographic structure of short circuited melted mark changed. The generation condition of short circuited melted mark in fire was simulated. The primary short circuited melted mark and the secondary short circuited melted mark of copper clad steel wire were prepared by changing the current. The results show that with the current increasing, the hole volume in the metallographic structure of primary short circuited melted mark increases.The quantities of the lath martensite decrease. The quantities of bainite without carbides increase. With the current increasing,the hole volume in the metallographic structure of secondary short circuited melted mark increases. The quantities of bainite without carbides decrease, and then, the quantities of pearlite increase.