摘要
研究了以硫代硫酸钠和硝酸银为主盐的体系时,电流密度对镀层表面形貌、结合力和镀层物相的影响。结果表明:在该体系中电流密度为0.1、0.2A/dm^2时,制备的镀层表面光亮平整、镀层结合力良好、电流效率高、镀层质量优异。
The effects of current density on the surface morphology, bonding force and phase of the coating were studied,taking thiosulfate and silver nitrate as system. The results show that when the current density is 0.1 and 0.2A/dm^2 in this system, the prepared coating exhibits bright and smooth surface, good bonding force, high current efficiency and excellent coating quality.
出处
《热加工工艺》
CSCD
北大核心
2017年第4期168-171,共4页
Hot Working Technology
基金
NSFC-云南联合基金(U1037601)
关键词
电镀银
电流密度
镀层
硫代硫酸盐
silver plating
current density
coating
thiosulfate
