摘要
分立器件类模具是制造电子元器件后道工序的关键设备。介绍了分立器件类模具的镶拼、引线入位、浮动对中、镶件固定等基本结构、原理,以及对分立器件类模具防漏胶分型面、高精度引线脚槽、小间隙ANTI-FLASH概念的应用、封装模自对中块结构等核心零部件进行设计的要点、计算公式、作用、设计原则。这有助于了解分立器件类模具结构,有利于模具的使用与维护。
The discrete devices mould is a key equipment in the manufacturing process of electronic components. This paper introduces the basic structure and working principle of discrete device mould,including the design key points, formulas, functions; design principles of the core parts of discrete components such as mould parting surface, pin groove; the application of ANTI-FLASH concept and packaging mould of self-centering block structure. It provides a basis and reference for discrete devices mould design, and is helpful to the use and maintenance of mould.
出处
《模具技术》
2017年第1期14-16,60,共4页
Die and Mould Technology
关键词
分型面
引线脚槽
自对中块
封装模浮动
分立器件
parting surface
lead pin slot
self-centering block
packaging mould floating
discrete device