期刊文献+

ICP刻蚀优化及在多波长分布反馈式激光器阵列中的应用 被引量:3

Parameter Optimization of Inductively Coupled Plasma and Its Application on Multi-Wavelength DFB Laser Array
原文传递
导出
摘要 研究了CH_4/H_2/Cl_2感应耦合等离子体刻蚀技术中的关键工艺参数对刻蚀性能的影响。通过对CH_4/H_2/Cl_2气体流量及流量比的优化,在自行设计的InP/InGaAlAs多量子阱结构的外延片上,实现了一种高速低损耗、形貌良好的Bragg光栅制作方法。基于优化后的工艺参数制作了多周期结构的λ/4相移光栅,实现了单片集成的四波长1.3μm分布反馈式激光器阵列。该激光器阵列中激光器的阈值电流典型值为11mA,外微分效率可达0.40 W/A,且实现了边摸抑制比大于46dB的稳定的单纵模激光输出。研究结果表明优化后的ICP光栅刻蚀工艺具有良好的刻蚀精度和可靠性。 The influence of the key process parameters of CH4/H2/C12 inductively coupled plasma (ICP) on the etching performance was systematically investigated. The flow density and the ratio in CH4/H2/C12 gas mixtures are optimized. Therefore, an effective method can be used for fabricating Bragg grating with high etching rate, low damage ICP etching and high quality surface on special designed InP/InGaA1As multiple quantum well wafer. Combined with post-process, four wavelengths 1.3 μm distributed feedback laser array was fabricated based on multi-period λ/4 shifted Bragg grating. The typical threshold current and the external differential efficiency are about 11 mA and 0.40 W/A, respectively. And the side mode suppression ratio of each laser diode is more than 46 dB. It can be verified that ICP etching processing in Bragg grating has high quality and reliability.
出处 《激光与光电子学进展》 CSCD 北大核心 2017年第3期194-199,共6页 Laser & Optoelectronics Progress
基金 国家高技术研究发展计划(2015AA016901)
关键词 激光器 分布反馈式激光器阵列 感应耦合等离子体刻蚀 InP/InGaAlAs 片上集成 lasers distributed feedback laser array inductively coupled plasma InP/InGaA1As on-chip integration
  • 相关文献

参考文献4

二级参考文献42

  • 1韩守振,田洁,冯帅,任承,李志远,程丙英,张道中.二维平板光子晶体直波导的制备和光传输特性的测量[J].物理学报,2005,54(12):5659-5662. 被引量:17
  • 2蔡鹏飞,孙长征,熊兵,王健,罗毅.无制冷高速直调1.5μm AlGaInAs-InP DFB激光器[J].光电子.激光,2007,18(6):666-668. 被引量:1
  • 3Deng L G,Rahman M, Murad S K,et al. Can dry-etching systems by designed for lower damage ab initio[J]. J Vac Sci Technol. 1998,B16 (6) :3334-3338.
  • 4Lord S M,Roos G, Harris J S,et al. Enhancement of photoluminescence intensity in InGaAs/AIx Gal-x as quantum wells by hydrogenation[J]. Appl Phys Lett, 1992,60(18) : 2276-2278.
  • 5Yu J S,Lee Y T. Parametric reactive ion etching of InP using O12 and CH4 gases:effects of H2 and Ar addition[J]. Semicand Sci Technol, 2002,17:230-236.
  • 6Strasser P,Wuest R,Robin F,et al. Detailed analysis of the influence of an inductively coupled plasma reactive-ion etching process on the hole depth and shape of photonic crystals in InP/InGaAsP[J]. J Vac Sci Technol,2007 ,B25(2) : 387-393.
  • 7Generic Recquirements CR-468-CORE. Generic reliability assurance requirernents for optoelectronic devices used in telecommunications equipment. Issue 1, December 1998, Teloordia Technologies, Inc. Piscataway,NJ 08854-4156,USA:5-16-5-18.
  • 8Plumb W D. Distributed feedback semiconductor lasers[M]. London: The Institution of Electrical Engineers,1998.
  • 9Saga N, Kawahara T, Kishi T, et al. Damage evaluation of inductive coupling plasma etching of InGaAsP/InP single quantum well[A]. Conf. Proc. of Indium Phosphide and Related Materials[C]. 2004,163- 166.
  • 10Rommel S L,Jang J H,Lu W,et al. Effect of H2 on the etch profile of InP/InGaAsP alloys in Cl2/Ar/H2 inductively coupled plasma reactive ion etching chemistries for photonic device fabrication[J]. J Vac Sci Technol,2002 ,B20(4) : 1327-1330.

共引文献12

同被引文献15

引证文献3

二级引证文献8

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部