阻焊孔口残油成因浅析

Root cause of solder mask residue of hole ring

防焊油墨若在需焊接位置有残留会导致装配时不上锡,影响最终产品的可靠性。文章研究了孔口残油的主要成因,并对成因做了理论上的解释,对预防此问题提供了建议措施。

No wetting or dewetting will appear if there is solder mask residue on the surface mounting pad. This paper is to find the root cause of solder mask residue of hole ring, and to explain the formation mechanism under the high related humidity environment. Next, the preventive actions are provided.